What type of analysis in FEA predicts thermal deformation during the 3D printing process?

A thermal-stress analysis in Finite Element Analysis (FEA) is used to predict thermal deformation during the 3D printing process. FEA is a numerical technique used to simulate the behavior of physical systems under various conditions. Thermal-stress analysis combines a thermal analysis, which calculates the temperature distribution within the part during printing, with a stress analysis, which calculates the resulting stresses and deformations caused by those temperature gradients. The thermal analysis takes into account factors such as heat input from the heat source (e.g., laser or nozzle), heat transfer through conduction, convection, and radiation, and material properties such as thermal conductivity and specific heat. The stress analysis then uses the calculated temperature distribution as an input to determine the thermal stresses, which can cause warping, distortion, and residual stresses in the printed part. This type of analysis allows engineers to predict and mitigate thermal deformation by optimizing printing parameters, part orientation, and support structures.