What are the limitations of using dry chemical fire suppression systems in areas with sensitive electronic equipment?

The primary limitation of using dry chemical fire suppression systems in areas with sensitive electronic equipment is the potential for damage and disruption caused by the dry chemical residue. Dry chemical agents, such as sodium bicarbonate, potassium bicarbonate, or monoammonium phosphate, are effective at suppressing fires, but they leave behind a fine powder residue that can contaminate and corrode electronic components. This residue can cause short circuits, overheating, and other malfunctions in sensitive electronic equipment, such as computers, servers, and telecommunications equipment. The dry chemical residue is also difficult to clean up. It can penetrate into small crevices and hard-to-reach areas, making complete removal challenging. Even after cleaning, residual dry chemical can continue to cause problems over time. Furthermore, dry chemical agents can be abrasive and can damage delicate surfaces, such as circuit boards and connectors. The residue can also attract moisture, which can further exacerbate corrosion and damage. In addition to the direct damage to electronic equipment, the dry chemical residue can also disrupt operations. The cleanup process can be time-consuming and expensive, and the downtime required to clean and repair the equipment can result in significant business losses. For these reasons, clean agent fire suppression systems, such as FM-200 or Novec 1230, are generally preferred for protecting areas with sensitive electronic equipment. Clean agents are non-conductive, non-corrosive, and leave no residue after discharge, minimizing the risk of damage to electronic components and disruption to operations. While dry chemical systems can be effective at suppressing fires, their limitations in areas with sensitive electronic equipment make them a less desirable option.