Explain how heterogeneous integration techniques, such as chiplet-based designs and 2.5D/3D packaging, can be used to overcome the limitations of monolithic GPU designs and enable future performance scaling.

Heterogeneous integration, encompassing techniques like chiplet-based designs and 2.5D/3D packaging, has emerged as a crucial strategy to overcome the limitations of monolithic GPU designs and pave the way for future performance scaling. Monolithic GPUs, where all components are fabricated on a single silicon die, face several challenges as technology advances. *Limitations of Monolithic GPU Designs: 1. *Yield Issues: As GPU die sizes increase, the probability of defects also increases, leading to lower yields and higher manufacturing costs. A single defect on a large monolithic die can render the entire chip unusable. 2. *Design Complexity: Designing and verifying increasingly complex monolithic GPUs becomes extremely challenging and time-consuming. The complexity of the design process scales non-linearly with the number of transistors. 3. *Reticle Size Limits: The size of a monolithic die is limited by the reticle size of the lithography equipment. Exceeding this limit requires stitching multiple reticles together, which can introduce alignment errors and increase manufacturing costs. 4. *Memory Bandwidth Bott....